The rapid growth of AI is transforming data centers, driving higher computing densities and creating unprecedented thermal management challenges. This session will explore the key cooling requirements of next-generation AI infrastructure, from increasing heat loads and energy consumption to the need for greater efficiency, reliability, and scalability. We will also examine how Midea’s advanced magnetic bearing chiller and CDU liquid-cooling solutions address these challenges, enabling efficient, reliable, and future-ready cooling for high-density data centers.